Produktneuheiten
- Hersteller
- Kategorien
- Anwendungsgebiete
-
Embedded-ComputermoduleDFI: COM-HPC RPS9HCCOM HPC Client Size C
[Intel Core i3-13100E | Intel Core i7-13700E | Intel Core i9-13900E]
262 Pin SO-DIMM DDR5
2 x G-LAN
12 x USB (intern)
Digital I/O (12-Bit)
10 x PCIe x130.01.2024+9
-
Embedded-ComputermoduleDFI: COM Express Compact MTH968COM Express Compact
BGA 2049
262 Pin SO-DIMM DDR5
LVDS
1 x G-LAN
12 x USB (intern)
Digital I/O (8-Bit)
1 x PCIe x124.01.2024+9
-
Embedded-ComputermoduleDFI: COM Express Basic RBT970COM Express Basic
[AMD Ryzen Embedded V3C14 | AMD Ryzen Embedded V3C18I | AMD Ryzen Embedded V3C48]
262 Pin SO-DIMM DDR5
8 x USB (intern)
Digital I/O (8-Bit)11.01.2024+9